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Ultrasonic soldering iron

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Category: Ultrasonic soldering

Changzhou Wellsin-Semi Equipment Co., Ltd. was established by an international talent team. Aiming at the wide application of ultrasonic technology and plasma technology in the semiconductor and microelectronics fields, it is committed to the development and sales of semiconductor-specific ultrasonic and plasma equipment, and cooperates with the Chinese Academy of Sciences, R&D cooperation with research institutes and other institutes to provide the industry with high-quality products and services.

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Product Details

Product introduction

Ultrasonic soldering iron uses ultrasonic high-frequency vibration to effectively break the oxide film on the metal surface. It can be soldered without flux and reduces the void ratio of the solder joint. With the help of special solder, ultrasonic soldering iron can also realize the soldering of glass, ceramics, graphite and other difficult-to-tin materials, and realize the low-temperature connection between glass and metal, graphite and metal. It is widely used in sensors, microelectronics, photovoltaics, aerospace, etc. field.

Product details

Innovative technology

Product technology


Model	USI-65	USI-40
Ultrasonic frequency	65KHZ	40KHZ
Ultrasonic power	5~15W	9~30w
Soldering iron tip size	1~4mm	6~10mm
Temperature range	150~480℃	150~480℃
Heating method	Ceramic heating tube	Ceramic heating tube
RS232 communication	Yes	Yes
Working voltage	100~240V	100~240V