Power semiconductors are the key to industries such as new energy vehicles, UHV, and robotics. With the application of SiC chips, the lighter and thinner IGBT has become a trend. At present, the seventh-generation power modules of companies such as Mitsubishi and Infineon have begun to use ultrasonic welding technology to achieve conductive connection. Compared with wire bonding (Wire Bonding) technology, ultrasonic welding can Provide better connection strength, conductivity and heat dissipation effect.
Changzhou Wellsin-Semi Equipment Co., Ltd. can provide customers with wire bonding and ultrasonic welding products to meet customers' demanding requirements for automotive electronics and avionics.
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