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Bonding Machine

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Changzhou Wellsin-Semi Equipment Co., Ltd. was established by an international talent team. Aiming at the wide application of ultrasonic technology and plasma technology in the semiconductor and microelectronics fields, it is committed to the development and sales of semiconductor-specific ultrasonic and plasma equipment, and cooperates with the Chinese Academy of Sciences, R&D cooperation with research institutes and other institutes to provide the industry with high-quality products and services.

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Based on the diffusion or fusion soldering technology of the solder, the connection between the chip and the substrate is realized to meet the requirements of efficient heat dissipation and strength.