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Metal Non-mental Bonding

Ultrasonic technology can not only realize the connection of glass and metal, but also realize the connection of various non-metals such as graphene, AlSiC, carbon fiber, diamond, alumina, silicon nitride, etc.
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Metal Non-mental Bonding

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Ultrasonic technology can not only realize the connection of glass and metal, but also realize the connection of various non-metals such as graphene, AlSiC, carbon fiber, diamond, alumina, silicon nitride, etc., to meet various requirements such as strength, sealing and heat dissipation. In this regard, Changzhou Wellsin-Semi Equipment Co., Ltd. has more than 10 years of process research experience and has served many domestic and foreign research institutes such as the Chinese Academy of Sciences, Harbin Institute of Technology, South China Institute of Technology, and China Shipbuilding Industry Corporation. We can provide customers with complete solutions from equipment design, process selection to test plans, etc.

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