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Dicing machine

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Category: Ultrasonic dicing
Changzhou Wellsin-Semi Equipment Co., Ltd. was established by an international talent team. Aiming at the wide application of ultrasonic technology and plasma technology in the semiconductor and microelectronics fields, it is committed to the development and sales of semiconductor-specific ultrasonic and plasma equipment, and cooperates with the Chinese Academy of Sciences, R&D cooperation with research institutes and other institutes to provide the industry with high-quality products and services.
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Product introduction

Ultrasonic dicing machine uses ultrasonic high-frequency vibration to enhance the cutting force of the cutter wheel, which can effectively reduce chipping defects. Wellcore Semiconductor is currently undergoing product development and process verification, so stay tuned.

 

Product introduction

Innovative technology

 

Maximum size of workpiece ¢6 inch/□160mm
Cutting depth Max 4mm
Spindle speed 3000-20000 R/min
Spindle power Exchange 1.5Kw
X-axis travel 240mm
Y-axis travel 200mm
Z-axis travel 30mm
Motion accuracy ±0.005mm
Blade breakage detection Standard configuration
Automatic alignment/automatic tool mark detection Standard configuration
Non-contact height measurement Standard configuration
Machine Vision Standard configuration
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