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Dicing machine

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Category: Ultrasonic dicing

Changzhou Wellsin-Semi Equipment Co., Ltd. was established by an international talent team. Aiming at the wide application of ultrasonic technology and plasma technology in the semiconductor and microelectronics fields, it is committed to the development and sales of semiconductor-specific ultrasonic and plasma equipment, and cooperates with the Chinese Academy of Sciences, R&D cooperation with research institutes and other institutes to provide the industry with high-quality products and services.

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Product Details

Product introduction

Ultrasonic dicing machine uses ultrasonic high-frequency vibration to enhance the cutting force of the cutter wheel, which can effectively reduce chipping defects. Wellcore Semiconductor is currently undergoing product development and process verification, so stay tuned.

Product introduction

Innovative technology

Maximum size of workpiece	¢6 inch/□160mm
Cutting depth	Max 4mm
Spindle speed	3000-20000 R/min
Spindle power	Exchange 1.5Kw
X-axis travel	240mm
Y-axis travel	200mm
Z-axis travel	30mm
Motion accuracy	±0.005mm
Blade breakage detection	Standard configuration
Automatic alignment/automatic tool mark detection	Standard configuration
Non-contact height measurement	Standard configuration
Machine Vision	Standard configuration