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Ultrasonic soldering

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Category: Ultrasonic soldering

Changzhou Wellsin-Semi Equipment Co., Ltd. was established by an international talent team. Aiming at the wide application of ultrasonic technology and plasma technology in the semiconductor and microelectronics fields, it is committed to the development and sales of semiconductor-specific ultrasonic and plasma equipment, and cooperates with the Chinese Academy of Sciences, R&D cooperation with research institutes and other institutes to provide the industry with high-quality products and services.

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Product Details

Product introduction

Ultrasonic tinning machine, also known as ultrasonic tinning machine, melts tin in the tin bath and uses ultrasonic vibration to achieve rapid tinning of copper, aluminum and other materials. It can also be used for silicon wafers and component terminals. Tinned. Jingxin Semiconductor can design various manual and automatic ultrasonic tinning machines according to customer needs to meet application requirements.

Product details

Innovative technology

The expert team of Wellcore Semiconductor has more than 10 years of experience in the development of ultrasonic tin plating, and has application demonstration cases in many fields.

Application example: Ultrasonic tinning of terminals

Application example: Ultrasonic tinning of wafers


	Manual tinning machine	Automatic tinning machine
Ultrasonic frequency	20KHZ	20KHZ
Ultrasonic power	800W	800W
Transducer	PZT piezoelectric ceramics	PZT piezoelectric ceramics
Dip tin method	Manual	Automatic lifting
Heating temperature	100~300℃	100~300℃
PLC control	None	Yes
Immersed tin area	¢60mm	60×60~150×150mm
Gas protection	None	Yes
Power input	220V	220V
Cooling method	Fan and compressed air (maximum 0.4Mpa)	Fan and compressed air (maximum 0.4Mpa)
Solder capacity	1~3KG	~70KG