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Category: Ultrasonic soldering
Changzhou Wellsin-Semi Equipment Co., Ltd. was established by an international talent team. Aiming at the wide application of ultrasonic technology and plasma technology in the semiconductor and microelectronics fields, it is committed to the development and sales of semiconductor-specific ultrasonic and plasma equipment, and cooperates with the Chinese Academy of Sciences, R&D cooperation with research institutes and other institutes to provide the industry with high-quality products and services.
Ultrasonic tinning machine, also known as ultrasonic tinning machine, melts tin in the tin bath and uses ultrasonic vibration to achieve rapid tinning of copper, aluminum and other materials. It can also be used for silicon wafers and component terminals. Tinned. Jingxin Semiconductor can design various manual and automatic ultrasonic tinning machines according to customer needs to meet application requirements.
The expert team of Wellcore Semiconductor has more than 10 years of experience in the development of ultrasonic tin plating, and has application demonstration cases in many fields.
Application example: Ultrasonic tinning of terminals
Application example: Ultrasonic tinning of wafers
|Manual tinning machine||Automatic tinning machine|
|Transducer||PZT piezoelectric ceramics||PZT piezoelectric ceramics|
|Dip tin method||Manual||Automatic lifting|
|Immersed tin area||¢60mm||60×60~150×150mm|
|Cooling method||Fan and compressed air (maximum 0.4Mpa)||Fan and compressed air (maximum 0.4Mpa)|
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