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At present, the investment cost of 5nm/3nm advanced process of semiconductor chips is high, and it is getting closer and closer to the limit.
Power semiconductors are the key to industries such as new energy vehicles, UHV, and robotics. With the application of SiC chips, the lighter and thinner IGBT has become a trend.
Sensors generally involve the packaging of materials such as glass and ceramics. The packaging of this type of material often requires magnetron sputtering gold plating to achieve metallization, and the process is complicated and costly.
Ultrasonic technology can not only realize the connection of glass and metal, but also realize the connection of various non-metals such as graphene, AlSiC, carbon fiber, diamond, alumina, silicon nitride, etc.
Metal Non-mental Bonding
Thanks to the ability of ultrasonic to destroy the oxide film, Changzhou Wellsin-Semi Equipment Co., Ltd. can provide a cost-effective solution for the new generation of double-sided PERC technology:
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